Iimpawu eziqhelekileyo ze-JOJUN6100 | |||
Ipropati | Iyunithi | Series Product | Indlela yoVavanyo |
JOJUN6100 | |||
Umbala |
| Customized | Okubonakalayo |
Ukutyeba | mm | 0.5-5 | I-ASTM D374 |
Ngokuthe ngqoUmxhuzulane | g/cc | 2.8 | I-ASTM D792 |
Ukuqina | Unxweme oo | 30-70 | I-ASTM D2240 |
IsiceloUbushushu | ℃ | -50 - +200 |
|
UkutshaIklasi |
| V0 | UL94 |
ThermalUkuqhuba | W/mK | 1 | I-ASTM D5470 |
YoyisakalaI-Voltage | KV/mm | >6 | I-ASTM D149 |
UmthamoUkuxhathisa | ohm-cm | 10 ^14 | I-ASTM D257 |
Idielectricrhoqo | 1MHz | 7 | I-ASTM D150 |
1. Ishishini le-LED
I-thermal conductive gasket isetyenziswa phakathi kwe-aluminium substrate kunye ne-heat sink.
I-thermal conductive gasket isetyenziswa phakathi kwe-aluminium substrate kunye negobolondo.
2. Ishishini lamandla
Sebenzisa umqhubi wokushisa phakathi kwe-MOS ityhubhu, i-transformer (okanye i-capacitor / i-PFC inductor) kunye ne-heat sink okanye indlu.
3. Ishishini lezonxibelelwano
I-Thermal conduction kunye nokutshatyalaliswa kobushushu phakathi kwebhodi enkulu ye-IC kunye ne-heat sink okanye igobolondo.
Ukuhanjiswa kobushushu kunye nokulahla ubushushu phakathi kwebhokisi yokuseta-phezulu DC-DC IC kunye neqokobhe.
4. Ishishini le-Automotive Electronics
I-gaskets ye-thermal conductive ingasetyenziselwa kwi-automotive electronic industry applications (ezifana ne-xenon lamp ballasts, ii-stereo, iimveliso zoluhlu lwezithuthi, njl.).
5. PDP/LED TV
Ukuqhuba kobushushu phakathi kwe-IC yeamplifier yamandla, i-decoder yomfanekiso we-IC kunye ne-heat sink (indlu).
Xuba Gxuma
Extrusion
Thermal Pad Production Line
Isityalo
Iphakheji
Iimpahla eziphumayo
I-Voltage Breakdown Tester
Thermal Conductivity Tester
Kneader
Ilebhu
I-gaskets ye-thermal conductive isetyenziselwa ukuzalisa isithuba somoya phakathi kwesixhobo sokufudumeza kunye ne-heat sink okanye isiseko setsimbi.Iimpawu zabo ezibhetyebhetye kunye ne-elastic zibenza bakwazi ukugquma iindawo ezingalinganiyo kakhulu.Ubushushu buthunyelwa ukusuka kwisixhobo sokwahlula okanye kwi-PCB yonke kwiqokobhe letsimbi okanye ipleyiti yokusasaza, enokuphucula ukusebenza kakuhle kunye nobomi benkonzo yezinto zokufudumeza i-elektroniki.Iphedi yokuqhuba ubushushu ifakwe phakathi kwepleyiti ebandayo yokuchitha ubushushu kunye netshiphu yokufudumeza ukuhambisa ubushushu obuveliswa yitshiphu kwipleyiti ebandayo yokuchitha ubushushu, ngaloo ndlela kuncitshiswa ubushushu betshiphu.Uxinzelelo loxinzelelo luya kwenzeka xa i-pad conduction pad ixinzelelwe.Uxinzelelo loxinzelelo luya kunyuka ngokunyuka kwexabiso loxinzelelo.Xa ukhetha i-pad conduction pad, qaphela ukuba uxinzelelo loxinzelelo lwe-heat conduction pad ngexesha lokunyanzeliswa akufanele libe lukhulu kunoxinzelelo olufunekayo olufunekayo kwi-chip chip, ngaphandle koko i-chip iya konakala.
1. Iqela le-R&D yobungcali
Inkxaso yovavanyo lwesicelo iqinisekisa ukuba awusenaxhala malunga nezixhobo ezininzi zovavanyo.
2. Intsebenziswano yokuthengisa imveliso
Iimveliso zithengiswa kumazwe amaninzi kwihlabathi liphela.
3. Ukulawula umgangatho ongqongqo
4. Ixesha lokuhambisa elizinzile kunye nokulawulwa kwexesha lokuhambisa umyalelo ofanelekileyo.
Siyiqela leengcali, amalungu ethu aneminyaka emininzi yamava kurhwebo lwamazwe ngamazwe.Siliqela eliselula, elizele yimpembelelo kunye nokuqamba izinto ezintsha.Siliqela elizinikeleyo.Sisebenzisa iimveliso ezifanelekileyo ukwanelisa abathengi kwaye siphumelele ukuthembela kwabo.Siliqela elinamaphupha.Iphupha lethu eliqhelekileyo kukubonelela abathengi ngezona mveliso zithembekileyo kunye nokuphucula kunye.Sithembe, siphumelele.
1. Ukuqhuba kakuhle kwe-thermal: 1-15 W / mK.
2. Ubulukhuni obuphantsi: Ubunzima buqala ukusuka kwi-Shoer00 10 ~ 80.
3. Ukugqunywa kombane.
4. Kulula ukuhlanganisa.
1. Iinxalenye ezimbini ze-gap filler, i-adhesive liquid.
2. I-Thermal conductivity: 1.2 ~ 4.0 W / mK
3. Ukufakwa kwamandla ombane aphezulu, ukunyanzeliswa okuphezulu, ukumelana nobushushu obuhle.
4. Ukusetyenziswa koxinzelelo, kunokufezekisa imisebenzi ezenzekelayo.
1. Ukuhlukana kweoli ephantsi (ukuya kwi-0).
2. Uhlobo oluhlala ixesha elide, ukuthembeka okulungileyo.
3. Ukumelana nemozulu enamandla (ukumelana nokushisa okuphezulu kunye nokuphantsi -40 ~ 150 ℃).
4. Ukuxhatshazwa komswakama, ukuxhathisa kwe-ozone, ukuguga ukuguga.