Umvelisi onobuchule obuchwephesha bezinto zokuqhuba ezishushu
Iminyaka eyi-10+ yamava okuVelisa
- tiger.lei@jojun.net
- +86 512-50132776
JOJUN-8600 Series Thermal Paste
Inkcazelo emfutshane:
Ngokufika kwexesha le-5G, iimveliso ze-elektroniki ziphuhlisa ekudityanisweni komsebenzi, kunye namacandelo amaninzi ngakumbi kwibhodi yesiphaluka, amandla eemveliso ze-elektroniki ayanda, kwaye iimfuno zokuqhuba ubushushu kwizinto eziphathekayo ze-thermal nazo zanda.Ngobunzima boyilo lokutshatyalaliswa kobushushu, ukudityaniswa kwemithombo yobushushu emininzi ngokubanzi, njenge-JOJUN-8600 Series Thermal Paste.Ukuphakama kunye nokuma kwemithombo yokushisa kuyahluka, kwaye i-thermal pad yobunzima obunye ayikwazi ukuhlangabezana nemfuno yokutshatyalaliswa kobushushu.
★ Iimpawu eziqhelekileyo zeJOJUN-8600 Series Thermal Paste
| I-Thermal ConductiveNcamathelisa | |||
| Ipropati | Iyunithi | Series Product | Indlela yoVavanyo |
| UYOHANE-8600 | |||
| Umbala |
| Luhlaza | Okubonakalayo |
| Ukuxinana | g/cc | 3.2 | I-ASTM D792 |
| Isantya Sokukhupha@30cc, 90psi | g/min | 10-90 |
|
| IsiceloUbushushu | ℃ | -50 ~+200 |
|
| UkutshaIklasi |
| V0 | UL94 |
| ThermalUkuqhuba | W/mK | 6 | I-ASTM D5470 |
| YoyisakalaI-Voltage | KV/mm | >5 | I-ASTM D149 |
| UmthamoUkuxhathisa | ohm-cm | 10^13 | I-ASTM D257 |
| Idielectricrhoqo | 1MHz | 7 | I-ASTM D150 |
★ Isicelo
Itshiphu ye-LED
Izixhobo zonxibelelwano,
I-CPU yefowuni ephathwayo,
Imodyuli yememori,
IGBT
Iimodyuli zamandla,
Intsimi ye-semiconductor yamandla.
★ Ukusetyenziswa
★ Inkqubo yeMveliso
Xuba Gxuma
Extrusion
Thermal Pad Production Line
Isityalo
Iphakheji
Iimpahla eziphumayo
★Iziko le-R&D
I-Voltage Breakdown Tester
Thermal Conductivity Tester
Kneader
Ilebhu
★Iimpawu kunye neeNzuzo
Xa kuthelekiswa nephedi ye-thermal, intlama ye-thermal ithambile kwaye inobudlelwane obungcono bomphezulu.Inokunyanzeliswa ukuya kubukhulu obuphantsi kakhulu, obuphucula kakhulu ukuhanjiswa kobushushu, kwaye inokucinezelwa ukuya kwi-0.1mm kweyona ndawo iphantsi.Ngeli xesha, i-tukumelana ne-hermal kunokuqala ukusuka kwi-0.08℃·kwi2/W ukuya ku-0.3℃·in2 / W, enokufikelela ekusebenzeni kwenxalenye yegrisi ye-silicone.Ukongeza, i-thermalncamathelisaphantse akukho bunzima, emva kokusetyenziswa kwezixhobo aziyi kuvelisa uxinzelelo lwangaphakathi.
I-thermal paste kulula ukusebenza nayo kunegrisi eshushu.Ukusetyenziswa ngokubanzi kwegrisi ye-silicone kukushicilela isikrini okanye ipleyiti yentsimbi, okanye ibrashi yokwaleka ngokuthe ngqo, ayinabuhlobo kakhulu kumsebenzisi kunye nokusingqongileyo, kwaye ngenxa yobumanzi bayo obuthile, ngokubanzi ayinakusetyenziselwa ukutyeba kune-0.2mm izihlandlo.
Kunye thermal conductivity udaka ukubunjwa ngokungenasizathu kwimilo efunwayo, kuba ibhodi PCB engalinganiyo kunye nezixhobo ezingaqhelekanga (ezifana neebhetri, iinxalenye kwikona, njl), inokuqinisekisa uqhagamshelwano elungileyo.I-gel ye-thermal ine-adhesion ethile, kwaye ayiyi kuba nengxaki yeoli kunye neyomileyo, inenzuzo ethile ekuthembekeni.
★ Izatifikethi
Iimpawu zeeMveliso zeThermal
-
Iimpawu zeThermal Pad
1. Ukuqhuba kakuhle kwe-thermal: 1-15 W / mK.
2. Ubulukhuni obuphantsi: Ubunzima buqala ukusuka kwi-Shoer00 10 ~ 80.
3. Ukugqunywa kombane.
4. Kulula ukuhlanganisa. -
Iimpawu ze-Thermal Paste
1. Iinxalenye ezimbini ze-gap filler, i-adhesive liquid.
2. I-Thermal conductivity: 1.2 ~ 4.0 W / mK
3. Ukufakwa kwamandla ombane aphezulu, ukunyanzeliswa okuphezulu, ukumelana nobushushu obuhle.
4. Ukusetyenziswa koxinzelelo, kunokufezekisa imisebenzi ezenzekelayo. -
Iimpawu ze-Thermal Grease
1. Ukuhlukana kweoli ephantsi (ukuya kwi-0).
2. Uhlobo oluhlala ixesha elide, ukuthembeka okulungileyo.
3. Ukumelana nemozulu enamandla (ukumelana nokushisa okuphezulu kunye nokuphantsi -40 ~ 150 ℃).
4. Ukuxhatshazwa komswakama, ukuxhathisa kwe-ozone, ukuguga ukuguga.
