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JOJUN-Gpu Thermal Pad Featured Image
  • JOJUN-Gpu Thermal Pad
  • JOJUN-Gpu Thermal Pad
  • JOJUN-Gpu Thermal Pad
  • JOJUN-Gpu Thermal Pad
  • JOJUN-Gpu Thermal Pad
  • JOJUN-Gpu Thermal Pad

JOJUN-Gpu Thermal Pad

Inkcazelo emfutshane:

Iphedi yobushushu:

I-JOJUN GPU i-thermal pads yenziwe nge-silicone resin njengesiseko sezinto kwaye izaliswe ngamasuntswana okuqhuba i-thermal.Injongo ephambili ye-thermal pad kukunciphisa ukuxhatshazwa koqhagamshelwano olwenziwa phakathi kobuso bomthombo wokushisa kunye noqhagamshelwano lomphezulu we-thermal sink. iinxalenye.Ukuzalisa i-gap yendawo yokudibanisa, indawo yokudibanisa umoya, umoya ngumqhubi ongekho kakuhle wokushisa, onokuthi uthintele kakhulu ukuhanjiswa kobushushu kwindawo yokudibanisa.Ngokuncediswa kwe-silica gel gasket eqhuba ubushushu, inokuba ngcono kwaye idibene ngokupheleleyo, ukudibana ubuso nobuso ngokwenene, impendulo kwiqondo lobushushu inokufikelela kumohluko omncinci onokwenzeka wobushushu.

 

Iimbonakalo:

①Ukuhanjiswa kwe-thermal ephezulu:I-Jojun thermal pad inokukhethwa kuluhlu lwe-1-15

②Ukuguquguquka okuphantsi:iimolekyuli ezincinci zinokulawulwa ngaphakathi kwe-150ppm, zilungele amacandelo achanekileyo aneemfuno eziphezulu.

③Ukuqina okuphantsi:Uluhlu lobulukhuni lunokukhethwa ngaphakathi kwe-shower00 10-80 degrees

④Uxinzelelo olulula:Uxinzelelo loxinzelelo lofakelo oluphantsi, usebenzisa iimeko ezahlukeneyo zesicelo


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Iimpawu zeeMveliso zeThermal

  • 1. Ukuqhuba kakuhle kwe-thermal: 1-15 W / mK.2. Ubulukhuni obuphantsi: Ubunzima buqala ukusuka kwi-Shoer00 10 ~ 80.3. Ukugqunywa kombane.4. Kulula ukuhlanganisa.

    Iimpawu zeThermal Pad

    1. Ukuqhuba kakuhle kwe-thermal: 1-15 W / mK.
    2. Ubulukhuni obuphantsi: Ubunzima buqala ukusuka kwi-Shoer00 10 ~ 80.
    3. Ukugqunywa kombane.
    4. Kulula ukuhlanganisa.

  • 1. Iinxalenye ezimbini ze-gap filler, i-adhesive liquid.2. I-Thermal conductivity: 1.2 ~ 4.0 W / mK3. Ukufakwa kwamandla ombane aphezulu, ukunyanzeliswa okuphezulu, ukumelana nobushushu obuhle.4. Ukusetyenziswa koxinzelelo, kunokufezekisa imisebenzi ezenzekelayo.

    Iimpawu ze-Thermal Paste

    1. Iinxalenye ezimbini ze-gap filler, i-adhesive liquid.
    2. I-Thermal conductivity: 1.2 ~ 4.0 W / mK
    3. Ukufakwa kwamandla ombane aphezulu, ukunyanzeliswa okuphezulu, ukumelana nobushushu obuhle.
    4. Ukusetyenziswa koxinzelelo, kunokufezekisa imisebenzi ezenzekelayo.

  • 1. Ukuhlukana kweoli ephantsi (ukuya kwi-0).2. Uhlobo oluhlala ixesha elide, ukuthembeka okulungileyo.3. Ukumelana nemozulu enamandla (ukumelana nokushisa okuphezulu kunye nokuphantsi -40 ~ 150 ℃).4. Ukuxhatshazwa komswakama, ukuxhathisa kwe-ozone, ukuguga ukuguga.

    Iimpawu ze-Thermal Grease

    1. Ukuhlukana kweoli ephantsi (ukuya kwi-0).
    2. Uhlobo oluhlala ixesha elide, ukuthembeka okulungileyo.
    3. Ukumelana nemozulu enamandla (ukumelana nokushisa okuphezulu kunye nokuphantsi -40 ~ 150 ℃).
    4. Ukuxhatshazwa komswakama, ukuxhathisa kwe-ozone, ukuguga ukuguga.

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