Umvelisi onobuchule obuchwephesha bezinto zokuqhuba ezishushu

Iminyaka eyi-10+ yamava okuVelisa

JOJUN-thermal paste cpu

Inkcazelo emfutshane:

Inxalenye enye yeNcama yeThermal:

Inxalenye enye ye-thermal paste yimveliso ye-thermal conductive kunye nokumelana ne-thermal ephantsi kunye noxinzelelo oluphantsi loxinzelelo.Inokuqondwa ngokusasaza kwaye isetyenziswe kuyo nayiphi na imilo yesixhobo sokuvelisa ubushushu kunye nokusebenza kakuhle kwendibano ephezulu kwaye ifanelekile kwimveliso ezenzekelayo.

Iimbonakalo:

①Ukufakwa kwamandla ombane aphezulu, uxinzelelo oluphezulu, uxinzelelo oluphantsi kunye nokumelana nobushushu obulungileyo.

②Izicelo zoxinzelelo oluphantsi lwemisebenzi ezenzekelayo.

 

Intlama yeThermal enezahlulo ezimbini:

Intlama ye-thermal enamacandelo amabini amacandelo amabini anyangekayo anokubumba umsantsa wokuzalisa umsantsa we-thermal, unokunyangwa kwiqondo lobushushu begumbi okanye ubushushu obuphezulu, kwaye unyangelwe ukwenza i-thermal conductivity ethambileyo negqwesileyo ye-elastomer.Ibunjwe ngokusasazwa kwezixhobo ezivelisa ubushushu.

Iimbonakalo:

①Ukuqhuba kwe-thermal ephezulu, ukuxhathisa okuphantsi kwe-thermal, ukumanzisa okugqwesileyo.

②Uxinzelelo lwendibano esezantsi, lunokuzalisa nasiphi na isikhewu esingalinganiyo.

③Inokubunjwa kuyo nayiphi na imilo ngokukhupha.

④Ukuthembeka okuphezulu, i-thermal conductive adhesive ilingana nefilimu ye-silicone ye-thermal conductive emva kokunyanga.


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Iinkcukacha zeMveliso

Iithegi zeMveliso

★ Iimpawu eziqhelekileyo zeJOJUN-8X20 Series Thermal Paste

I-Thermal ConductiveNcamathelisa

Ipropati

Iyunithi

Series Product

Indlela yoVavanyo

UJOJUN-8350

Umbala

 

Ngwevu

Okubonakalayo

Ukuxinana

g/cc

3.1

I-ASTM D792

Isantya Sokukhupha@30cc, 90psi

g/min

10-90

 

IsiceloUbushushu

-50 ~+200

 

UkutshaIklasi

 

V0

UL94

ThermalUkuqhuba

W/mK

3.5

I-ASTM D5470

YoyisakalaI-Voltage

KV/mm

>5

I-ASTM D149

UmthamoUkuxhathisa

ohm-cm

10^13

I-ASTM D257

Idielectricrhoqo

1MHz

7

I-ASTM D150

★ Isicelo

Itshiphu ye-LED
Izixhobo zonxibelelwano,
I-CPU yefowuni ephathwayo,
Imodyuli yememori,
IGBT
Iimodyuli zamandla,
Intsimi ye-semiconductor yamandla.

svsv
i-cnymym (2)
i-cnymym (1)

★ Ukusetyenziswa

gkmg

★ Inkqubo yeMveliso

Xuba Gxuma

Xuba Gxuma

Extrusion

Extrusion

Thermal Pad Production Line

Thermal Pad Production Line

Isityalo

Isityalo

Iphakheji

Iphakheji

Iimpahla eziphumayo

Iimpahla eziphumayo

★Iziko le-R&D

xcccccccc

I-Voltage Breakdown Tester

Umzobo2

Thermal Conductivity Tester

Umzobo

Kneader

Umzobo3

Ilebhu

★Iimpawu kunye neeNzuzo

1.Enye yeempawu ezibalaseleyo zale ntlama ye-thermal yi-conductivity yayo ebalaseleyo yobushushu, obungena kwi-12 W/MK enomtsalane.Oku kuthetha ukuba isebenza kakhulu ekugqithiseni ubushushu ukusuka kwi-CPU okanye kwi-GPU ukuya kwinkqubo yakho yokupholisa, iqinisekisa ukusebenza okugqibeleleyo kunye nozinzo lwekhompyuter yakho.

2.Enye inzuzo yochungechunge lwe-JOJUN-8X20 kukuba yinto enezinto ezimbini ekulula ukuyigcina.Oku kwenza kube lula ukuhlala ukho kuzo naziphi na izicelo ezizayo kwaye ikuvumela ukuba uyisebenzise nanini na xa uyifuna.

3.Le ntlama ye-thermal iphinda ibonise iimpawu ezikhethekileyo eziphezulu kunye nobushushu obuphantsi kunye nokuqina kweekhemikhali.Iyakwazi ukumelana namaqondo okushisa aphezulu, aphezulu naphantsi, ngaphandle kokuthotywa kwexesha, iqinisekisa ukusebenza kakuhle kungakhathaliseki iimeko.

★ Izatifikethi

ce

Iimpawu zeeMveliso zeThermal

  • 1. Ukuqhuba kakuhle kwe-thermal: 1-15 W / mK.2. Ubulukhuni obuphantsi: Ubunzima buqala ukusuka kwi-Shoer00 10 ~ 80.3. Ukugqunywa kombane.4. Kulula ukuhlanganisa.

    Iimpawu zeThermal Pad

    1. Ukuqhuba kakuhle kwe-thermal: 1-15 W / mK.
    2. Ubulukhuni obuphantsi: Ubunzima buqala ukusuka kwi-Shoer00 10 ~ 80.
    3. Ukugqunywa kombane.
    4. Kulula ukuhlanganisa.

  • 1. Iinxalenye ezimbini ze-gap filler, i-adhesive liquid.2. I-Thermal conductivity: 1.2 ~ 4.0 W / mK3. Ukufakwa kwamandla ombane aphezulu, ukunyanzeliswa okuphezulu, ukumelana nobushushu obuhle.4. Ukusetyenziswa koxinzelelo, kunokufezekisa imisebenzi ezenzekelayo.

    Iimpawu ze-Thermal Paste

    1. Iinxalenye ezimbini ze-gap filler, i-adhesive liquid.
    2. I-Thermal conductivity: 1.2 ~ 4.0 W / mK
    3. Ukufakwa kwamandla ombane aphezulu, ukunyanzeliswa okuphezulu, ukumelana nobushushu obuhle.
    4. Ukusetyenziswa koxinzelelo, kunokufezekisa imisebenzi ezenzekelayo.

  • 1. Ukuhlukana kweoli ephantsi (ukuya kwi-0).2. Uhlobo oluhlala ixesha elide, ukuthembeka okulungileyo.3. Ukumelana nemozulu enamandla (ukumelana nokushisa okuphezulu kunye nokuphantsi -40 ~ 150 ℃).4. Ukuxhatshazwa komswakama, ukuxhathisa kwe-ozone, ukuguga ukuguga.

    Iimpawu ze-Thermal Grease

    1. Ukuhlukana kweoli ephantsi (ukuya kwi-0).
    2. Uhlobo oluhlala ixesha elide, ukuthembeka okulungileyo.
    3. Ukumelana nemozulu enamandla (ukumelana nokushisa okuphezulu kunye nokuphantsi -40 ~ 150 ℃).
    4. Ukuxhatshazwa komswakama, ukuxhathisa kwe-ozone, ukuguga ukuguga.


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