Itshiphu ye-LED
Izixhobo zonxibelelwano,
I-CPU yefowuni ephathwayo,
Imodyuli yememori,
IGBT
Iimodyuli zamandla,
Intsimi ye-semiconductor yamandla.
Xuba Gxuma
Extrusion
Thermal Pad Production Line
Isityalo
Iphakheji
Iimpahla eziphumayo
I-Voltage Breakdown Tester
Thermal Conductivity Tester
Kneader
Ilebhu
Ngokugqithiswa kakuhle kobushushu, kwangaxeshanye kunye neyomileyo eqinileyo, hayi ukuqina, ayinyibiliki, ayinancasa kwaye ayinayo ityhefu;
I-conductivity egqwesileyo ye-thermal, kunye nokuhlukana kweoli ephantsi, ioli yeqondo lokushisa eliphezulu, ukushisa okuphezulu akuhambi;
Ukusebenza kwe-insulation egqwesileyo, i-non-toxic kunye ne-tasteless, akukho kunyangwa, akukho mhlwa kwi-substrate, iipropati zekhemikhali kunye nezomzimba zizinzile;
Ukumelana nokushisa okuphezulu kunye nokuphantsi, ukuxhathisa kwamanzi, i-ozone, ukuxhathisa ukuguga kwemozulu, kunokusetyenziswa kwindawo ephezulu kunye nephantsi kweqondo lokushisa ixesha elide;
I-thixotropy efanelekileyo, ukuhambelana okuphakathi, kulula ukuyisebenzisa, ukugubungela okanye inkqubo yokutywina ilula;
Ngokugquma kombane okugqwesileyo, kunye ne-thermal conductivity egqwesileyo, kwangaxeshanye kunye nokwahlulwa kweoyile ephantsi (idla ngo-zero), ukumelana nobushushu obuphezulu naphantsi, ukumelana namanzi, i-ozone, ukuxhathisa ukuguga kwemozulu.
1. Ukuqhuba kakuhle kwe-thermal: 1-15 W / mK.
2. Ubulukhuni obuphantsi: Ubunzima buqala ukusuka kwi-Shoer00 10 ~ 80.
3. Ukugqunywa kombane.
4. Kulula ukuhlanganisa.
1. Iinxalenye ezimbini ze-gap filler, i-adhesive liquid.
2. I-Thermal conductivity: 1.2 ~ 4.0 W / mK
3. Ukufakwa kwamandla ombane aphezulu, ukunyanzeliswa okuphezulu, ukumelana nobushushu obuhle.
4. Ukusetyenziswa koxinzelelo, kunokufezekisa imisebenzi ezenzekelayo.
1. Ukuhlukana kweoli ephantsi (ukuya kwi-0).
2. Uhlobo oluhlala ixesha elide, ukuthembeka okulungileyo.
3. Ukumelana nemozulu enamandla (ukumelana nokushisa okuphezulu kunye nokuphantsi -40 ~ 150 ℃).
4. Ukuxhatshazwa komswakama, ukuxhathisa kwe-ozone, ukuguga ukuguga.