Isinyithi solwelo luhlobo olutsha lwetsimbi olubonelela ngokupholisa okungcono.Kodwa ngaba ngokwenene kuwufanele umngcipheko?
Kwihlabathi lezixhobo zekhompyuter, impikiswano phakathi kwentlama ye-thermal kunye nentsimbi engamanzi yokupholisa i-CPU iye yafudumala.Njengoko iteknoloji ihambela phambili, isinyithi solwelo siye saba yenye indlela ethembisayo kwintlama ye-thermal yendabuko eneempawu ezingcono zokupholisa.Kodwa umbuzo usamile: Ngaba ngokwenene kuwufanele umngcipheko?
Intlama ye-Thermal, eyaziwa ngokuba yi-thermal paste okanye igrisi eshushu, ibe lukhetho oluqhelekileyo lokupholisa i-CPU iminyaka.Yinto esetyenziswa phakathi kwe-CPU kunye ne-heatsink ukuzalisa iziphene ezincinci kunye nokubonelela ngokutshintshwa kobushushu obungcono.Ngelixa iwenza umsebenzi wenziwe ngempumelelo, inemida kwindlela eqhuba ngayo ubushushu ngokufanelekileyo.
Isinyithi esilulwelo, kwelinye icala, singena kwimarike kwaye sithandwa kakhulu ngenxa ye-thermal conductivity ephezulu.Yenziwe kwi-alloy yensimbi kwaye inamandla okubonelela ngokusebenza okupholileyo okubhetele xa kuthelekiswa ne-paste yendabuko ye-thermal.Nangona kunjalo, kukho imingcipheko ehambelana nokusebenzisa isinyithi se-liquid, njengeempawu zayo zokuqhuba, ezinokuthi zifake isongelo kwiisekethe ezimfutshane ukuba zisetyenziswe ngokungalunganga.
Ngoko ke, yeyiphi engcono?Ekugqibeleni kuxhomekeke kwiimfuno kunye neenjongo zomsebenzisi.Kwabo babeka phambili ukhuseleko kunye nokulula kokusetyenziswa, ukunamathela kwi-paste yendabuko ye-thermal kunokuba lukhetho olufanelekileyo.Nangona kunjalo, kwii-overclockers kunye nabanomdla abafuna ukutyhala i-hardware yabo kwimida yayo, i-Liquid Metal inokuba lukhetho oluhehayo.
Kodwa ngaphambi kokuba wenze isigqibo, kubalulekile ukuvavanya iingenelo kunye neengozi zokhetho ngalunye.Ngelixa isinyithi solwelo siqhuba ngcono ubushushu, kunokuba nzima ukusisebenzisa nokususa, kwaye singonakalisa i-CPU kunye namanye amacandelo ukuba ayiphathwanga kakuhle.I-Thermal paste, kwelinye icala, kulula ukuyisebenzisa kwaye ibeka ingozi encinci, kodwa isenokunganikeli umgangatho ofanayo wokupholisa njengesinyithi solwelo.
Ekugqibeleni, ukhetho phakathi kwe-thermal paste kunye ne-liquid metal yehla kwi-trade-off phakathi kokusebenza kunye nomngcipheko.Ukuba unokumelana nomngcipheko kwaye uqinisekile kubuchule bakho bokusebenzisa isinyithi elulwelo ngokuchanekileyo, kunokuba kufanelekile ukuqwalasela izibonelelo zokupholisa ezinokubakho.Nangona kunjalo, ukuba ubeka phambili ukhuseleko kunye nokulula ukuyisebenzisa, ukunamathela kwintlama ye-thermal yendabuko kunokuba lolona khetho lusebenzayo.
Ukuqukumbela, impikiswano phakathi kwe-thermal paste kunye ne-liquid metal yokupholisa i-CPU iyaqhubeka, kungekho ophumeleleyo ocacileyo.Zombini iinketho zineenzuzo kunye neengxaki zazo, kwaye isigqibo sokugqibela sehla kwizinto ezikhethwa ngumsebenzisi ngamnye kunye nezinto eziphambili.Nokuba yeyiphi na inketho oyikhethayo, kubalulekile ukuqhubeka ngobunono kwaye uqwalasele ngononophelo iingozi ezinokubakho.
Ixesha lokuposa: Jan-08-2024