Isixhobo sombane siya kuvelisa ubushushu xa sisebenza.Ukushisa akulula ukuqhuba ngaphandle kwezixhobo, okwenza ukushisa kwangaphakathi kwezixhobo zombane kukhuphuke ngokukhawuleza.Ukuba kukho rhoqo indawo yokushisa ephezulu, ukusebenza kwezixhobo zombane kuya konakala kwaye ubomi benkonzo buya kuncitshiswa.Umjelo obu bushushu bugqithileyo ngaphandle.
Xa kufikwa kunyango lokutshatyalaliswa kobushushu bezixhobo zombane, isitshixo yinkqubo yonyango lokutshatyalaliswa kobushushu kwibhodi yesekethe yePCB.Ibhodi yesekethe ye-PCB yinkxaso yamacandelo e-elektroniki kunye nomthwali woqhagamshelwano lombane lwamacandelo e-elektroniki.Ngophuhliso lwesayensi kunye netekhnoloji, izixhobo ze-elektroniki nazo ziphuhlisa ukudityaniswa okuphezulu kunye ne-miniaturization.Kuyacaca ukuba akwanelanga ukuthembela kuphela kubushushu obuphezulu bokutshatyalaliswa kwebhodi yesekethe yePCB.
Xa uyila indawo yebhodi ye-PCB yangoku, injineli yemveliso iya kuqwalasela okuninzi, njengaxa uqukuqela umoya, iya kumpompoza ukuya esiphelweni ngokuxhathisa okuncinci, kwaye zonke iintlobo zokusetyenziswa kwamandla amacandelo e-elektroniki kufuneka ziphephe ukufaka imiphetho okanye iikona, ukuze kuthintelwe ukuhanjiswa kobushushu ngaphandle ngexesha.Ukongeza kuyilo lwendawo, kuyafuneka ukuba kufakwe izinto zokupholisa kumacandelo anamandla aphezulu e-elektroniki.
Imathiriyeli yokuzalisa umsantsa we-Thermally yi-gap enobuchwephesha egcwalisa i-thermal conductive material.Xa iinqwelomoya ezimbini ezigudileyo nezithe tyaba zidibene enye kwenye, kusekho izikhewu.Umoya kwi-gap uya kuthintela isantya sokuqhuba ubushushu, ngoko ke i-thermal conductive gap filling material iya kuzaliswa kwi-radiator.Phakathi komthombo wobushushu kunye nomthombo wobushushu, susa umoya kwi-gap kwaye unciphise ujongano loqhagamshelwano lokumelana nobushushu, ngaloo ndlela ukwandisa isantya sokuqhuba ubushushu kwiradiyetha, ngokunciphisa ubushushu bebhodi yesekethe ye-PCB.
Ixesha lokuposa: Aug-21-2023