Iiseva kunye nokutshintsha kumaziko edatha okwangoku zisebenzisa ukupholisa umoya, ukupholisa ulwelo, njl njl. ukuphelisa ubushushu.Kwiimvavanyo zangempela, eyona nto iphambili yokulahla ubushushu kwiseva yiCPU.Ukongeza kokupholisa umoya okanye ukupholisa ulwelo, ukukhetha i-interface efanelekileyo ye-thermal interface kunokuncedisa ukutshatyalaliswa kobushushu kunye nokunciphisa ukunyanzeliswa kwe-thermal yekhonkco yonke yokulawula i-thermal.
Kwizixhobo ze-thermal interface, ukubaluleka kokuhamba okuphezulu kwe-thermal kuyabonakala, kwaye injongo ephambili yokwamkela isisombululo se-thermal kukunciphisa ukuchasana kwe-thermal ukufezekisa ukuhanjiswa kobushushu okukhawulezayo ukusuka kwiprosesa ukuya kwi-heat sink.
Phakathi kwezixhobo ze-thermal interface, igrisi ye-thermal kunye nesigaba sokutshintsha izinto zinamandla okuzalisa i-gap (ikhono lokumanzisa i-interfacial wetting) kuneepads ze-thermal, kunye nokuphumeza umaleko onqabileyo onamathelisiweyo, ngaloo ndlela unikezela ukuxhathisa okuphantsi kwe-thermal.Nangona kunjalo, igrisi ye-thermal idla ngokuchithwa okanye igxothwe ngokuhamba kwexesha, okukhokelela ekulahlekelweni kwe-filler kunye nokulahlekelwa ukuzinza kokutshatyalaliswa kobushushu.
Izinto zokutshintshwa kwesigaba zihlala ziqinile kwiqondo lokushisa kwaye ziya kunyibilika kuphela xa iqondo lokushisa elichaziweyo lifikeleleke, linika ukhuseleko oluzinzileyo lwezixhobo zombane ukuya kwi-125 ° C.Ukongeza, ezinye izinto zokutshintsha izinto zesigaba zinokufezekisa imisebenzi yokufakelwa kombane.Ngexesha elifanayo, xa ukutshintshwa kwesigaba sibuyela kwisimo esiqinileyo phantsi kweqondo lokushisa lokuguquka kwesigaba, sinokugwema ukuxoshwa kwaye sibe nokuzinza okungcono ebomini bonke besixhobo.
Ixesha lokuposa: Oct-30-2023